Newsletter Vol.61

• Work Piece: Automotive parts
• Model: JHU-3506CNC Cylindrical Grinding Machine
• Maximum work swing: 350mm
• Maximum grinding length: 600mm
• Maximum grinding diameter: 330mm
• Machine Features: With its high flexibility, the machine adapts to various workpiece shapes and grinding requirements, ensuring precise dimension control and enhancing surface finish. It is ideal for components that require high surface precision and efficiency

Make Semiconductor Material Grinding More Efficient

To meet the requirements of advanced wafer manufacturing, the JHC centerless grinding machine series provides reliable performance and improves the efficiency and quality of outer diameter grinding for critical process materials. Its main advantages include:

─── High Grinding Efficiency
Traditional grinding processes that previously required several hours can now be completed within tens of minutes (depending on the workpiece), resulting in higher processing efficiency.
─── Broad Diameter Compatibility
The grinding capability supports a wide outer diameter processing range, providing excellent application flexibility
─── Strong Material Removal Capability
Equipped with a large diameter grinding wheel, the machine delivers excellent material removal rates while ensuring stable grinding accuracy and consistent surface quality.
─── High Precision and Consistency
The process helps ingots meet the dimensional accuracy, surface finish and consistency required for wafer manufacturing.
─── Automation Integration
The machine can be equipped with automation and gauging devices (depending on the workpiece), which helps improve process yield and overall production efficiency.

— Exhibition —
TMTS 2026

— Date of exhibition —
Mar.25 – 28, 2026

— Location —
Taichung International Convention and Exhibition Center (TICEC)

— Booth —
E0839

2025 December 25 ▶ Constitution Day
2026 January 1 ▶ New Year's Day

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