Sub-Micron Grinding Solutions for Third-Generation Semiconductors and Hard-Brittle Materials

Designed for SiC, Silicon Wafers and Solid-State Battery Materials, the JAINNHER JHP Series Sets a New Standard in High-Precision Grinding

The JAINNHER JHP Plunge Grinding Series is specifically engineered to overcome the challenges of processing "Hard and Brittle" materials. Designed for the semiconductor, optoelectronics, and new energy sectors, the JHP Series features superior machine rigidity and micro-feed control. This effectively eliminates grinding vibrations, preventing edge chipping and micro-cracking—making it a critical link in the production chain from crystal growth to final polishing.

Through the integration of specialized grinding wheels, advanced cooling and "Smart Machine Function" , the JHP Series delivers stable performance across high-end materials:

• Semiconductors: Silicon Wafers, SiC, and GaN.
• Advanced Ceramics & Optics: Quartz, Glass, Zirconia, and Alumina.
• New Energy: Precision grinding of "Special Hard Cylindrical Materials" used in solid-state battery production (LCO, LFP, NCM, etc.).

To meet high-end process demands, the JHP series offers proven technical solutions, having successfully completed 6", 8", and 12" SiC ingot grinding tests for Taiwan’s leading semiconductor manufacturers.

Minimizing Yield Loss

Optimized spindle design ensures surface integrity, significantly reducing scrap rates for SiC and GaN ingots.

Extreme Geometric Accuracy

Meets the strictest tolerances for roundness and cylindricity required in semiconductor manufacturing.

Reliable High-Volume Output

Can equip with robotic arms to keep the quality consistent across every batch.

Precision starts with the machine’s foundation and spindle. The JHP Series integrates specialized features for extreme hardness:

• Meehanite cast iron base: provides the vibration-damping and thermal stability essential for ultra-precision.
• Hydrodynamic spindle: superior to traditional bearing spindles, our hydrodynamic design enhances surface finish by absorbing micro-vibrations.
• Specialized evacuation design: for hard and brittle materials prone to high heat, the unique grinding wheel design significantly enhances waste removal and heat dissipation efficiency, preventing thermal damage to the material surface

To ensure production yield and the stability of automated operations, the JHP Series can be equipped with a comprehensive online monitoring system and measurement devices

• Advanced touch probe: for precise datum setting
• In process gauge: for closed-loop diameter control
• Automatic balancing & wheel crash control: grinding wheel automatic balancing while rotating
• Wheel crash control: by monitoring machine vibration, the system automatically accelerates during the idle stroke—when the wheel is not in contact with the workpiece—significantly boosting grinding efficiency.

One-Stop Turnkey Solutions

Jainnher offers more than just a grinding machine. We provide a complete solution—including wheel selection, parameter optimization, and AI-assisted systems—tailored to your specific industrial needs.

JHP Series Core Technical Specifications