Advanced Semiconductor Grinding Solutions

Designed for SiC, Silicon Wafers, and Solid Hard Battery Materials: Achieving Sub-micron High-Precision Grinding

The newly developed JHP Series Cylindrical Grinding Machine by JAINNHER is specifically designed to meet the precision machining challenges of "high-hardness, high-brittleness" materials in the modern semiconductor, optoelectronics, and new energy industries. This equipment features exceptional machine rigidity and micro-feed control, effectively suppressing grinding vibrations to prevent edge chipping or micro-cracks in hard-brittle materials. It is an indispensable precision grinding tool for integrated processes—from crystal growth and slicing to grinding and polishing.

The JHP Series offers broad material adaptability. By integrating exclusive grinding wheels, cooling systems, measurement units, and AI assistance, it ensures stable processing for the following high-end materials:

• Semiconductor and Wide Bandgap (WBG) Materials: Silicon Wafers, Silicon Carbide (SiC), Gallium Nitride (GaN)
• Optical and Advanced Insulating Materials: Quartz, Glass, Fiberglass, Ceramics, Zirconia, Alumina
• New Energy and Battery Applications: Supports key battery raw materials such as LCO, LFP, NCM, NCA, LMO, Graphite, and Silicon-based materials; specifically designed for precision grinding of "special hard cylindrical materials" in solid form

Addressing the high-end process requirements of leading Silicon wafer and SiC crystal growth plants in Taiwan, the JHP Series provides tangible technical solutions. It has successfully completed cylindrical grinding tests for 6-inch, 8-inch, and 12-inch SiC ingots for renowned domestic WBG semiconductor manufacturers, backed by highly reliable performance verification:

• Suppression of Chipping in Hard-Brittle Materials: Optimized spindle design for SiC and GaN ingot processing ensures the integrity of the machined surface, reducing scrap rates and effectively improving yield.
• Ensured High Roundness and Cylindricity: Meets the rigorous geometric tolerance requirements of the semiconductor industry for ingot outer diameters and orientation flat machining.
• Stable Mass Production: Can be integrated with automated robotic arms to ensure high consistency in batch processing.

Core Hardware Architecture Built for Hard-Brittle Materials

To perfectly machine extremely hard materials, the machine's chassis and "heart" are key. The JHP Series introduces several exclusive designs:

• Meehanite Cast Iron Body: The use of Meehanite cast iron provides the machine with high strength, density, homogeneity, and wear resistance, offering the most stable foundation for sub-micron machining.
• High-Damping Hydrodynamic Spindle: The grinding wheel spindle utilizes a hydrodynamic design. Compared to traditional bearing spindles, it offers superior damping and vibration resistance, significantly enhancing surface finish.
• Special Chip-Removal Wheel Design: For hard-brittle materials prone to high heat, the unique wheel arrangement improves chip removal and heat dissipation, preventing thermal damage to the material surface.

Intelligent In-process Gauge System

To ensure yield and stability in unmanned production, the JHP Series is equipped with comprehensive online monitoring and measurement protection:

• End-Face Measurement: Precisely detects the end-face position to ensure the machining reference point.
• OD Measurement: Real-time monitoring of outer diameter dimensions during processing to achieve closed-loop size compensation.
• Automatic Dynamic Balancing: Built-in vibration sensors monitor spindle balance online and calibrate the wheel's dynamic balance in real-time to maintain precision.
• Gap Elimination & Acoustic Emission (AE) Detection: High-sensitivity AE sensors monitor vibration to detect collisions. It also allows for automatic acceleration during air-cut segments, preventing crashes while significantly boosting efficiency.

JHP Series Core Technical Specifications

For semiconductor crystal growth plants and new energy equipment providers, JAINNHER provides more than just standalone machines. We offer a comprehensive one-stop solution for specific hard-brittle materials, including "wheel selection, cutting parameter optimization, automated loading/unloading, measurement systems, and AI-assisted systems."